发明名称 |
Method for manufacturing thin-film multilayer electronic component and thin-film multilayer electronic component |
摘要 |
In a method for manufacturing a thin-film multilayer electronic component, dielectric thin films and thin-film internal electrodes are alternately layered on each other to form a laminate. The thin-film internal electrodes are alternately displaced in a predetermined direction to form an overlap portion. The entire thickness of the laminate and a portion of the thickness of the substrate are cut to form grooves in portions other than the overlap portion, in a direction that is substantially perpendicular to the predetermined direction. External electrodes are formed on at least the cut surfaces of the laminate and the half-cut surfaces of the substrate. Then, the substrate is fully cut in the thickness direction along the grooves such as not to substantially remove the external electrodes.
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申请公布号 |
US2004043599(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
US20030638385 |
申请日期 |
2003.08.12 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TAKESHIMA YUTAKA |
分类号 |
H01G4/33;H01L21/02;(IPC1-7):H01L21/476 |
主分类号 |
H01G4/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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