| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus capable of eliminating rotational reaction and cleaning unevenness due to an abrasive sheet, reducing the running cost of the abrasive sheet by eliminating occurrence of part where does not contribute to cleaning, stably performing rotation irrespectively of using amount of the polishing sheet, and further realizing high speed rotation. SOLUTION: A rotational unit 35 is formed by using two sets of cleaning devices 37 respectively formed of a supply roll 41 and a take-up roll 42 of the abrasive sheet 40 and a sheet back up 43 placed between both rolls 41, 42 bringing the abrasive sheet 40 into contact with a substrate A. In the rotational unit 35 the two sets of the cleaning devices 37 are located so as to hold a shaft center of a spline shaft 24 in between wherein the one and the other of the supply rolls 41 and the one and the other of the take-up rolls 42 of both cleaning devices 37 are located on both sides thereof mutually in positional relationships of point symmetries with respect to the shaft center of the spline shaft 24. COPYRIGHT: (C)2004,JPO
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