| 摘要 |
A structure for use in a semiconductor processing environment is provided, including a first plate (24), a second plate (26) bonded to the first plate (24). A distal end (32) of the second plate (26) extends beyond a distal end (34) of the first plate. The distal end (34) of the first plate (24) is tapered along a length at least one-half of a width (W1) of the first plate (24) adjacent the tapered distal end (34) of the first plate. In an illustrated embodiment, the plate are quartz members of a wafer transfer arm, experiencing moments when loaded with a wafer. |
