| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a carrier for transfer of a flexible printed circuit board which can correspond to different mounting methods by the same carrier for transfer, and an electronic component mounting method to the flexible printed circuit board. <P>SOLUTION: A carrier 10 is constituted by providing a base board 11, wherein a resin layer 12 having a surface in close contact with a substrate 1 is formed, with an opening part 10e for back-up allowing a back-up part for bonding a semiconductor device to pass through, and an opening part 10c for a reference pin which allows a reference pin 15 for positioning the substrate 1 to pass through. The reference pin 15 is positioned at the opening part 10c for a reference pin by positioning the carrier 10 to a packaging jig 13 by means of a positioning pin 14, and the substrate 1 is brought into close contact with a resin layer 12 aligning a reference hole 1a with the reference pin 15. Thereby, it is possible to tightly hold the substrate 1 in its positioned state and to correspond to different packaging methods by the same carrier. <P>COPYRIGHT: (C)2004,JPO |
