| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate without deformation even after monolithic sintering. <P>SOLUTION: The multilayer substrate is adapted such that a plurality of ceramic green sheets each having a conductor pattern printed and formed thereon are laminated into a plate-shaped molding, and the conductor pattern and the ceramic green sheets are sintered in a monolithic manner. In the multilayer substrate, there are provided a plurality of first parting grooves in a principal surface of the multilayer substrate in parallel to each other, a plurality of second parting grooves perpendicular to the first parting grooves, internal circuit components on a plurality of individual laminates parted along the first and second parting grooves by making use of a conductor pattern, and a deformation suppressing conductor layer comprising the conductor pattern around an individual laminate formation region on the multilayer substrate. <P>COPYRIGHT: (C)2004,JPO</p> |
