SUBSTRATE PROCESSING SYSTEM

摘要

A system comprising a first robotic arm assembly for capturing and releasing a semiconductor wafer, a second robotic arm for capturing and releasing an interleaf, and a controller for actuation of the first and second robotic arms, the first and second robotic arms operating substantially simultaneously. At least one robotic arm can include a transfer arm, which includes a counterweight attached to the first end of the transfer arm and an end effector attached to the second end of the transfer arm. Two robotic arms permit the system to carry out the steps substantially simultaneously and therefore increase throughput significantly.