| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify the structure of an electronic part mounting device using plasma cleaning. <P>SOLUTION: The electronic part mounting device 1 is equipped with a chamber 2 subjecting a board 91 and an electronic part 92 to plasma cleaning, a mounting mechanism 3 mounting the electronic part 92 on the board 91, and a transfer robot 4 transferring the board 91 and the electronic part 92 from the chamber 2 to the mounting mechanism 3. The board 91 and the electronic part 92 subjected to plasma cleaning are quickly transferred to the mounting mechanism 3 by the transfer robot 4, the electronic part 92 is mounted on the board 91 by the mounting mechanism 3, and then pulse heating is given. By this setup, the electronic part 92 can be properly mounted on the board 91 while exposed to the air, and a mounting mechanism can be made simple in mechanism. <P>COPYRIGHT: (C)2004,JPO |
