| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for radio recognition at low cost. <P>SOLUTION: A lead wire 13 comprises connection terminals 14 and an antenna section 15. The connection terminals 14 of the lead wire 13 are inserted into both ends of a glass tube 12, with a chip 11 which stores recognition numbers read out by radio in between. Both ends of the glass tube 12 are filled with powder glass 16. Thereafter, the powder glass 16 is melted and solidified to be welded to the glass tube 12 and the lead wire 13, and a sealing section 17 is formed for sealing the chip 11 and the connection terminals 14. A melting point of the powder glass 16 is lower than that of the glass tube 12, and is set lower than a long-time reliability assurance temperature of a metal of which the chip 11 is formed. <P>COPYRIGHT: (C)2004,JPO |
