发明名称 RADIATION-CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a radiation-curable adhesive to a substrate coated with a radiation-curable ink material, or a radiation-curable binder for mutually bonding substrates each coated with such a radiation-curable ink material. SOLUTION: A radiation-curable resin composition which is useful as the above adhesive or binder or a radiation-curable coating material because of being highly adhesive to the substrate coated with the radiation-curable ink material and also being good in surface properties, comprises (A) 10-50 wt.% of urethane (meth)acrylate and (B) 50-90 wt.% of a (meth)acrylate, other than the component(A), having structural units of the formula(1):(CH<SB>2</SB>CH<SB>2</SB>O)<SB>n</SB>( wherein, (n) is 1-14 ) with the repeating number being 1 to 14. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004067866(A) 申请公布日期 2004.03.04
申请号 JP20020228681 申请日期 2002.08.06
申请人 JSR CORP;DSM IP ASSETS BV 发明人 YOSHIZAWA JUNJI;TONSHO SHINJI;KOMIYA ZEN
分类号 C08F299/02;C08F290/06;C09D4/02;C09D5/00;C09D171/00;C09D175/14;C09J4/02;C09J171/00;C09J175/14;(IPC1-7):C08F299/02 主分类号 C08F299/02
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