THIN FILM CAPACITOR, WIRING BOARD CONTAINING IT, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTED WITH IT, AND ELECTRONIC EQUIPMENT SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a thin film capacitor that is constituted so that its initial characteristics immediately after manufacturing may not change even after the capacitor is mounted on a multilayered wiring board or an LSI chip by avoiding a fault due to a short circuit or open circuit caused when the capacitor is deformed by a step in wiring at the time of containing or mounting the capacitor in or on the board or LSI chip, and to provide a multilayered wiring board or semiconductor integrated circuit mounted with the capacitor and an electronic equipment system containing the board or circuit.

SOLUTION: The thin film capacitor is provided with a capacitor section 123 in which a lower electrode 102 is formed on a substrate 101 and a dielectric thin film 103 and an upper electrode 104 are laminated upon a partial area of the electrode 102, a connecting terminal section 122 in which an external connecting electrode 107 is led out upward from the area of the electrode 102 in which the dielectric thin film 103 is not formed, and a connecting terminal section 124 in which an external connecting electrode 106 is led out upward from an external connecting electrode receiver 102b formed on the substrate 101. Between the capacitor section 123 and both connecting terminal sections 122 and 124, gaps 108 are provided. The electrode 106 is led out from the upper electrode 104 to the electrode receiver 102b and the stress formed by the deformation of the capacitor when the capacitor is contained/mounted is absorbed by the gaps 108.

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