发明名称 LASER CUTTING METHOD AND APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser cutting method and apparatus which can provide a desired irradiation shape and intensity distribution of a cutting irradiation beam by a simple constitution. <P>SOLUTION: In this method, cracks 30, 31 formed in a cutting origin of a substrate 3 are directed along a predetermined cutting line 40 by utilizing thermal stress created upon laser beam irradiation to cut the substrate 3. An incident beam 10 is diffracted by a diffraction optical element 2 to generate an irradiation beam 20 having predetermined irradiation shape and strength distribution. The substrate 3 is irradiated with the generated irradiation beam 20. One example of the irradiation beam 20 is a strip beam having substantially uniform intensity distribution along the predetermined cutting line 40. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004066745(A) 申请公布日期 2004.03.04
申请号 JP20020232017 申请日期 2002.08.08
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI;YOSHIMURA KAZUTO
分类号 G02B5/18;B23K26/00;B23K26/06;B23K26/073;B23K26/40;B28D5/00;C03B33/09;H01S3/00;H01S3/10;H01S3/101;(IPC1-7):B28D5/00 主分类号 G02B5/18
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