发明名称 |
EQUIPMENT SECURING THIN AND FLEXIBLE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide equipment or a chuck securing a thin and/or flexible substrate, and thereby sucking the substrate uniformly over the entire surface without a defect such as a warp or a bend. SOLUTION: The chuck 1 includes a notch 4 and a hole 5 communicating with a plurality of fine grooves 7 disposed on a support face 2. When a vacuum unit 6 sucks air through the notch 4 and the hole 5, the vacuum is extended to the fine grooves 7, for sucking the substrate 3 placed on the support face 2. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004072108(A) |
申请公布日期 |
2004.03.04 |
申请号 |
JP20030283892 |
申请日期 |
2003.07.31 |
申请人 |
SUSS MICROTEC LITHOGRAPHY GMBH |
发明人 |
WALTER DEMEL;ZOBERBIER RALPH |
分类号 |
G03F7/20;B23Q3/08;H01L21/027;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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