发明名称 EQUIPMENT SECURING THIN AND FLEXIBLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide equipment or a chuck securing a thin and/or flexible substrate, and thereby sucking the substrate uniformly over the entire surface without a defect such as a warp or a bend. SOLUTION: The chuck 1 includes a notch 4 and a hole 5 communicating with a plurality of fine grooves 7 disposed on a support face 2. When a vacuum unit 6 sucks air through the notch 4 and the hole 5, the vacuum is extended to the fine grooves 7, for sucking the substrate 3 placed on the support face 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004072108(A) 申请公布日期 2004.03.04
申请号 JP20030283892 申请日期 2003.07.31
申请人 SUSS MICROTEC LITHOGRAPHY GMBH 发明人 WALTER DEMEL;ZOBERBIER RALPH
分类号 G03F7/20;B23Q3/08;H01L21/027;H01L21/683;(IPC1-7):H01L21/68 主分类号 G03F7/20
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