发明名称 METHOD FOR BONDING SPACER TO POSITIVE ELECTRODE PLATE OF FIELD EMISSION DISPLAY
摘要 PROBLEM TO BE SOLVED: To provide a process by which a spacer can be simply bonded to a positive electrode plate of a field emission display. SOLUTION: This process comprises a process of providing a positive electrode plate equipped with a plurality of fluorescent regions and a plurality of black matrices, a process of forming a magnetic layer on the black matrices, a process of forming a thin metal film on the positive electrode plate and the magnetic layer, a process of arranging a spacer on the thin metal film above the black matrices, a process of heating the magnetic layer by carrying out an electromagnetic induction process to generate heat as a heat source and heating the spacer by the heat through the thin metal film, and a process of bonding the spacer to the thin metal film on the black matrices by carrying out a DC electric field process. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071537(A) 申请公布日期 2004.03.04
申请号 JP20030128316 申请日期 2003.05.06
申请人 IND TECHNOL RES INST 发明人 YANG SHAUE-AN;RI SEICHU;HSIAO MING-CHUN;HUANG JUNG-TANG
分类号 H01J9/24;H01J9/02;H01J9/18;H01J9/227;(IPC1-7):H01J9/24 主分类号 H01J9/24
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