METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board with few laser ashes after carbon dioxide laser beam machining.

SOLUTION: An insulating layer comprising thermosetting polyphenylene ether resin is formed as an essential component on both faces or one face of a substrate having a surface of a micro-etched inner layer circuit. A via hole for connecting the inner layer circuit and an outer layer circuit formed on a surface is formed on the insulating layer by carbon dioxide gas laser beam machining. The surface of the insulating layer and the via hole are desmeared and the via hole and the surface of the insulating layer are metal-plated. Thus, the multilayer printed wiring board is manufactured.

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