| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer interconnection board which surely permits fine interlayer connection as well as fine wiring pattern formation, and which is high in reliability. <P>SOLUTION: In a multilayer interconnection board, the wiring pattern formed by embedding the same into the interlayer insulating material layer 105 of a connecting layer is connected to a part to be connected 112 of a layer to be connected 111 by a conductor post 107, and a metallic connecting material layer 108. The connecting layer and the layer to be connected is connected by a metallic connection adhesive agent layer 109. In such a multilayer interconnection board, the interlayer insulating material layer 105 is provided with a thermal expansion coefficient of not lower than 15ppm and not higher than 25ppm in the temperature region of -65°C to 150°C. <P>COPYRIGHT: (C)2004,JPO</p> |
