SEMICONDUCTOR DEVICE PRODUCTION EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide semiconductor device production equipment that covers leakage appropriately for performing the process by sealing spaces between respective chambers in a multiple manner, even if the leakage occurs at a minus side. SOLUTION: The semiconductor device production equipment 700 has a load lock chamber 100; at least one process chamber 300 in which the process is performed on a wafer; a transfer chamber 200 through which the wafer in the chamber 100 is passed when it is transferred into the process chamber 300; a gate 500 that intervenes between a set of adjacent chambers in the above chambers and connects the set of chambers; and a gate valve that disposed at the gate 500 and separately seals a space between each set of chambers connected by the gate 500. COPYRIGHT: (C)2004,JPO