METHOD AND DEVICE FOR CLEANING SILICON WAFER WITH HYDROGEN FLUORIDE (HF)

摘要

PROBLEM TO BE SOLVED: To improve the yield of a silicon wafer by suppressing the formation of pits on the surface of the wafer at the time of cleaning the wafer with a HF-based solution. SOLUTION: At the time of cleaning the silicon wafer with the HF-based solution, the wafer is dipped in the solution while the surface of the wafer is illuminated. When the silicon wafer to the surface of which a metal adheres is dipped in the HF-based solution and kept in the illuminated state, paired electron-holes (e--h+) are generated. The electrons e-of the paired electron-holes are supplemented as the incremental amount of electron consumption during the course of a hydrogen generating reducing reaction. Consequently, the formation of pits on the surface of the silicon wafer is suppressed when the wafer is cleaned with the HF-based solution. COPYRIGHT: (C)2004,JPO