发明名称 |
Universal package for an electronic component with a semiconductor chip and method for producing the universal package |
摘要 |
An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.
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申请公布号 |
US2004041251(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
US20030652362 |
申请日期 |
2003.08.29 |
申请人 |
GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUEMPFL CHRISTIAN;WEIN STEFAN;WORNER HOLGER |
发明人 |
GOLLER BERND;HAGEN ROBERT-CHRISTIAN;OFNER GERALD;STUEMPFL CHRISTIAN;WEIN STEFAN;WORNER HOLGER |
分类号 |
H01L23/31;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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