| 摘要 |
A process to enhance metal line layout designs is provided and includes two separate control spaces to address capacitive issues along speed sensitive pathways in an integrated circuit structure without negatively impacting the Werner Fill process. One control space (i.e., DRCgap1) is for decreasing the spacing between various metal features to standardize such spacing, and a second control space (i.e., DRCgap2) is for addressing capacitance issues along speed sensitive pathways. Between speed sensitive pathways, spacing of added metal features provided to long parallel metal lines are maintained at the second control spacing DRCgap2. Spaces at the ends of such long parallel metal lines are reduced to the first control spacing DRCgap1 in order to best fill three-way-intersections (TWIs) with subsequent depositions.
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