| 摘要 |
A plasma processing system and a method for processing a substrate with a plasma processing system. An aspect of the invention provides a plasma processing system that comprises a chamber, including a processing region and an opening, a plasma generating system, constructed and arranged to produce a plasma during a plasma process in the processing region, a chuck, constructed and arranged to support a substrate within the chamber in the processing region, a ring member arranged in the chamber and a moving assembly, constructed and arranged to move the ring member, wherein the ring member is mounted on a periphery of the chuck such that when the substrate is being processed the ring member seals the opening. |
