| 摘要 |
<p>PURPOSE: To provide a semiconductor device and a package constituted of material which has characteristics of a low dielectric constant, a low dielectric loss tangent, low moisture absorption and high thermostructural property as an insulator. CONSTITUTION: The semiconductor device uses resin including the compound of a (chemical formula 1) having a plurality of styrene groups(however, R shows a hydrocarbon skeleton which may have a substituent, R¬1 shows hydrogen, methyl or ethyl, (m) shows 1 to 4 and (n) shows an integer >=2) as bridge components. Thus, the semiconductor element and the package are excellent in transmission characteristic and reduce the power consumption.</p> |
