| 摘要 |
PROBLEM TO BE SOLVED: To adequately perform the shut-down of a semiconductor chip mounted in a so-called multi-chip module in which a plurality of semiconductor chips are arranged only in one package. SOLUTION: A semiconductor chip 30 for voltage adjustment performs shut-down by itself based on a first setting temperature, and a semiconductor chip 50 for amplifier is arranged in the same package as the semiconductor chip 30 for voltage adjustment and performs shut-down by itself based on a second setting temperature. This semiconductor chip 30 for voltage adjustment outputs a signal for the shut-down of the semiconductor chip 50 for amplifier via a bus 14 when the semiconductor chip 30 reaches by itself a third setting temperature which is lower than the first setting temperature. COPYRIGHT: (C)2004,JPO |
