| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable semiconductor device and its manufacturing method by avoiding the risk of any movement of a heat dissipation block, any deformation of bonding wire and any penetration of resin around the front surface of the heat dissipation block in packaging and by enabling stable bonding and stable wire bonding between a heat sink and a lead, in the case of a semiconductor device with a built-in heat sink. SOLUTION: The semiconductor device is composed of a semiconductor element 6, which is arranged in space formed by a lead 2 of a lead frame 1 and is fixed to a die pad 3 of the lead frame with its bonding pad connected to the lead using wire, and of thermally conductive material. Its circumference is formed in such a size that overlaps the size of the lead. On the lead, the heat dissipation block 5 or the heat sink is provided with the semiconductor element arranged through tape-like insulators located on part of the lead and arranged directly or through the die pad in the center location. The semiconductor device is sealed with resin and the like, excluding part of the lead and the end surface of the heat dissipation block, or part of the lead. COPYRIGHT: (C)2004,JPO
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