摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method for highly accurately inspecting overflowed electric charges and transfer efficiency of a vertical transfer section in entire imaging areas when a solid-state imaging unit receives emission of such a strong light as causing movement of signal electric charges between a plurality of photodiodes or even when the signal electric charges do not amount to a maximum transfer charge capacity of the vertical transfer section. SOLUTION: Producing a state wherein a packet reading photodiode information of at least one pixel or over and a packet not reading photodiode information of at least one pixel or over exist in the vertical transfer section within an imaging area outputs all packet information externally without mixing the information by the vertical transfer section, a horizontal transfer section, and an electric charge detection section. COPYRIGHT: (C)2004,JPO
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