Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures

摘要

Semiconductor chip (2) has semiconductor component structures and contact surfaces (19) on an active upper side (3). A protective buffer (4) with protective layer (23) made from cushioning material is arranged between contact surfaces and above semiconductor component structures. The buffer body has a hard coating (22) on the free surface of the protective layer. Independent claims are also included for the following: (1) Semiconductor wafer with the above semiconductor chips arranged in lines and gaps; (2) Process for the production of a semiconductor wafer; (3) Process for the production of a semiconductor chip; and (4) Process for mounting the wafer or chip on substrates.