| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pad dressing and chemical mechanical polishing method whereby a removing profile at the center of a wafer can be enhanced without problems regarding costs, complication or control caused by a new design of a polishing head. <P>SOLUTION: The polishing pad is dressed by rotating a pad dresser 100 with respect to the rotating polishing pad, and slurry is supplied to the polishing pad. The wafer is chemically and mechanically polished by rotating the wafer with respect to the rotating polishing pad. The rotating direction of the pad dresser 100, the polishing pad and the wafer is constituted by combination of predetermined rotating directions. <P>COPYRIGHT: (C)2004,JPO |
