| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for a printed wiring board, which can improve the adhesion between a copper pattern and a resin layer without chemical polishing, such as blacking treatment, in manufacturing the printed wiring board, and to provide the printed wiring board using the same. SOLUTION: The resin composition for the printed wiring board contains a compound represented by formula (1), in an amount of 0.1-10 wt.% based on 100 wt.% of the composition. The printed wiring board is manufactured by using the resin composition. COPYRIGHT: (C)2004,JPO
|
