发明名称 BONDING DEVICE AND BONDING TOOL OF ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a bonding device and a bonding tool for bonding an electronic part, wherein a heater, which is used for heating a pressure-bonding part used for bonding an electronic part to a board by pressure, hardly impedes the free vibrations of a horn. SOLUTION: The heater 38 heating the pressure-bonding part 30 is pasted on the surface of the horn 15 near the pressure-bonding part 30 with an elastic and heat-resistant resin material 39. The heater 38 is pasted on the horn 15 with the elastic and heat-resistant resin material 39, so that the heater 38 is stably kept in contact with the horn 15 and hardly impedes the free vibrations of the horn 15, and the horn 15 grows stable in vibration characteristics. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071607(A) 申请公布日期 2004.03.04
申请号 JP20020224551 申请日期 2002.08.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HISAKU MASAFUMI;TAKAHASHI SEIJI
分类号 H05K3/32;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/32
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