| 摘要 |
The method for making plastic packages of the present invention includes: forming an electroless Cu plating film on a resin substrate after removing a Cu foil; disposing a first plating resist pattern thereupon, passing electricity through the electroless Cu plating film, and disposing an electrolytic Cu plating film where the pattern is absent; disposing a second plating resist pattern to form a circuit pattern, and disposing a Ni and Au plating film; removing the plating resist pattern and etching away the Ni and Au plating film and the electroless Cu plating film not covered by the electrolytic Cu plating film; and disposing a solder resist film with openings to expose an external terminal connection pad and a semiconductor element connection pad. This method provides superior bonding properties with a solder resist, reduces undercutting during etching, allows use of high-density circuits, provides high reliability, and improves yield.
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