Process for producing a semiconductor wafer

摘要

The method involves etching the semiconducting wafer (1), whereby an etching medium (2) flows along a flow direction in a laminar manner to an edge of the semiconducting wafer. A protective shield (5) is mounted in front of the edge of the wafer so that the etching medium flows against the shield and not against the edge of the wafer. The shield can be inclined to the flow direction of the etching medium.