Method and apparatus for applying solder to a substrate

摘要

The method involves melting solder wire (7) in a mixing chamber (6) and feeding it into a flow of gas and moving or lowering a two medium nozzle (4) relative to the substrate (1) so as to deposit solder blown out of the nozzle onto the substrate. The solder wire is fed to the mixing chamber in a guide tube (9) and its end is retracted into the guide tube to interrupt the deposition process. AN Independent claim is also included for the following: (a) a device for applying solder to a substrate.