| 发明名称 |
METHOD FOR JOINING SURFACES, SEMICONDUCTOR WITH JOINED SURFACES, BIO-CHIP AND BIO-SENSOR |
| 摘要 |
The invention relates to a method for bonding surfaces, and to a semiconductor with surfaces bound thereby, and to bio-chips and bio-sensors comprising this semiconductor. |
| 申请公布号 |
AU2003266280(A1) |
申请公布日期 |
2004.03.03 |
| 申请号 |
AU20030266280 |
申请日期 |
2003.08.12 |
| 申请人 |
MICRONAS HOLDING GMBH;KLAPPROTH, HOLGER |
发明人 |
HOLGER KLAPPROTH |
| 分类号 |
C09D4/00;C09J5/00;C09J5/04;H01L21/58;H01L21/98;H01L51/00;H01L51/30;(IPC1-7):G01N33/543 |
主分类号 |
C09D4/00 |
| 代理机构 |
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代理人 |
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