| 发明名称 |
ELECTRONIC CHIP AND ELECTRONIC CHIP ASSEMBLY |
| 摘要 |
<p>A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip.</p> |
| 申请公布号 |
EP1393370(A2) |
申请公布日期 |
2004.03.03 |
| 申请号 |
EP20020748564 |
申请日期 |
2002.06.03 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HOENLEIN, WOLFGANG;KLOSE, HELMUT;KREUPL, FRANZ;SIMBUERGER, WERNER |
| 分类号 |
H01L25/18;H01L21/60;H01L23/485;H01L25/065;H01L25/07;(IPC1-7):H01L23/498 |
主分类号 |
H01L25/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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