| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a high-performance heat-dissipating device in which smaller-diameter pins are arranged at high density in such a way that the generation of defectives is reduced by a method, wherein the heat dissipating device is molded by using a mold in which hole parts sufficiently deeper than the height of the pins are formed and the pins are cut at a prescribed height. SOLUTION: In pin holes 212, only entrance parts through which a material is guided have diameters which are equal to diameters of pins, and diameters at the inside of the pin holes 212 are made thicker than those of the entrance parts. By this structure, the material which is passed through the entrance parts of the pin holes 212 does not come into contact with the pin holes 212 any longer. In addition, the respective pin holes 212 are not subjected to any limit in the direction of their depth, until they reach a die counter punch 22. Then, pin parts at a press finished product are in serted into a die for cutting the pin legs are cut by an edge, and heights of the pins are made uniform at a prescribed height. |
