发明名称 |
Three-dimensional stacked heat spreader assembly for electronic package and method for assembling |
摘要 |
A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge portion extending upwardly; a cavity formed in-between the upper heat spreader and the lower heat spreader by engaging the first edge portion and the second edge portion together adapted for receiving an electronic device.
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申请公布号 |
US6700783(B1) |
申请公布日期 |
2004.03.02 |
申请号 |
US20030345861 |
申请日期 |
2003.01.15 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIU CHUN-KAI;CHIANG SHIN-TERNG |
分类号 |
H01L23/31;H01L23/36;H01L25/10;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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