发明名称 |
Dielectric structure and method of formation |
摘要 |
A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively formed on the first layer, wherein the sticker layer includes a partially cured PID material. A second layer is nonadhesively formed on the sticker layer, wherein the second layer includes a second fully cured PID material, wherein the sticker layer is nonadhesively sandwiched between the first layer and the second layer such that the sticker layer is in non-adhesive contact with the first layer and in non-adhesive contact with the second layer, and wherein the sticker layer is capable of remaining in non-adhesive contact with the first layer and the second layer until the sticker layer is subsequently subjected to additional curing.
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申请公布号 |
US6699350(B2) |
申请公布日期 |
2004.03.02 |
申请号 |
US20020217616 |
申请日期 |
2002.08.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATT ANILKUMAR C.;FUERNISS STEPHEN J.;MAGNUSON ROY H.;MARKOVICH VOYA R. |
分类号 |
B32B7/04;H05K3/00;H05K3/46;(IPC1-7):B32B31/00;B05D5/12 |
主分类号 |
B32B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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