发明名称 Selective silicide blocking
摘要 A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has suicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and silicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.
申请公布号 US6700163(B2) 申请公布日期 2004.03.02
申请号 US20010683278 申请日期 2001.12.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BREITWISCH MATTHEW J.;BROWN JEFFREY S.;HOOK TERENCE B.;MANN RANDY W.;PUTNAM CHRISTOPHER S.;YOUNUS MOHAMMAD I.
分类号 H01L21/8238;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L21/8238
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