| 发明名称 |
Room temperature gold wire bonding |
| 摘要 |
The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
|
| 申请公布号 |
US6698646(B2) |
申请公布日期 |
2004.03.02 |
| 申请号 |
US20020241495 |
申请日期 |
2002.09.11 |
| 申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
CHEN KIM H;CHOI SOOJIN;CHAN CHUN YEE;NIGOS JOHNNY MONIS |
| 分类号 |
H01L21/60;B23K20/00;H01L21/607;H01L23/49;(IPC1-7):B23K1/06 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
