| 摘要 |
PURPOSE: A vertical type furnace and a method for manufacturing a semiconductor device using the same are provided to improve the uniformity of wafers by uniformly flowing process gas into a process tube. CONSTITUTION: A vertical type furnace is provided with a vertical type process tube(10) for carrying out predetermined semiconductor processes, a wafer boat(40) installed at the inner portion of the process tube for loading wafers, and a manifold(50). At this time, the manifold includes a body part for supporting the lower portion of the process tube, a hole formed at the center portion of the body part for passing the wafer boat, a plurality of gas jet ports formed at the inner peripheral portion of the body part for supplying process gas into the process tube, and a gas inlet port formed at the outer peripheral portion of the body part for being connected through the gas jet ports.
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