Surface mounting substrate having bonding pads in staggered arrangement

摘要

A surface mounting substrate is configured to surface mount a semiconductor element thereon, the semiconductor element having a plurality of protruding electrodes arranged in a staggered arrangement of two rows. A plurality of bonding pads formed on a substrate are arranged in a staggered arrangement corresponding to the staggered arrangement of the protruding electrodes of the semiconductor element. Each of the bonding pads includes a pad portion having a substantially uniform width and an end portion extending from the pad portion toward the other row of the bonding pads. The end portion of each of the bonding pads lacks a portion extending beyond a boundary between the end portion and the pad portion of the bonding pads arranged in the other row. Accordingly, a reliable mounting can be achieved even if the protruding electrodes are offset from bonding pads.