发明名称 |
Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board |
摘要 |
In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.
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申请公布号 |
US6698093(B2) |
申请公布日期 |
2004.03.02 |
申请号 |
US20010913512 |
申请日期 |
2001.11.28 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHII TOSHIHIRO |
分类号 |
H05K1/11;H05K3/00;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H01K3/10 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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