发明名称 Light emitting device package
摘要 A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and electrically conductive strips attached to the contact pads and the electrically insulating layer.
申请公布号 US6700136(B2) 申请公布日期 2004.03.02
申请号 US20010682163 申请日期 2001.07.30
申请人 GENERAL ELECTRIC COMPANY 发明人 GUIDA RENATO
分类号 H01L25/075;H01L33/62;H01L33/64;(IPC1-7):H01L21/00 主分类号 H01L25/075
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