发明名称 Method for manufacturing a metal-insulator-metal capacitor
摘要 A method of manufacturing a MIM capacitor having a bottom electrode is provided by forming a metal wire including copper on a substrate. After the metal wire is formed on the substrate, a dielectric film is formed on the metal wire. A top electrode film is formed on the dielectric film, and then the top electrode film is etched to form a top electrode. A hard metallic polymer formed during the etching of the top electrode film is removed using a mixture of an oxygen gas and a fluorocarbon based gas. The lifting of the thin films is effectively prevented, and the yield of the manufacturing process for manufacturing a MIM capacitor is increased. Additionally, the MIM capacitor has a uniform capacitance because the damage to the dielectric film is prevented, and the oxidation of the bottom electrode is also prevented.
申请公布号 US6699749(B1) 申请公布日期 2004.03.02
申请号 US20030429321 申请日期 2003.05.05
申请人 SAMSUNG ELECTRONICS, CO., LTD. 发明人 LEE SEUNG-GUN;KIM IL-GOO;CHANG HO-SEN;CHANG JU-HYUK;HAH SANG-ROK
分类号 H01G4/08;H01G4/33;H01G13/00;H01G13/06;H01L21/02;H01L21/3065;H01L21/3213;H01L21/822;H01L21/8242;H01L27/04;(IPC1-7):H01L21/824 主分类号 H01G4/08
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