| 摘要 |
PURPOSE: To solve the problem wherein, for example, even if the displacement quantity in the Z direction caused by thermal deformation of a probe card 8 is anticipated by making a pseudo contact state by preheating the probe card 8 before inspection at the high-temperature inspection time, the displacement quantity in the Z direction caused by thermal deformation by heating during inspection can not be predicted, and also the displacement in the Z direction of the probe card 8 caused by a contact load at the inspection time can not be predicted. CONSTITUTION: This probe device 10 is equipped with a temperature-adjustable main chuck 12 for placing a wafer W thereon, a driving device such as an XY table 13 for moving the main chuck 12 in the X, Y and Z directions, and the probe card 14 arranged over the main chuck 12 moved through the driving device. The probe device is characterized by being provided with a laser displacement sensor 16 for measuring the height of the probe card on the XY table 13.
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