发明名称 |
Modular semiconductor die package and method of manufacturing thereof |
摘要 |
A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
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申请公布号 |
US6700138(B2) |
申请公布日期 |
2004.03.02 |
申请号 |
US20020081146 |
申请日期 |
2002.02.25 |
申请人 |
SILICON BANDWIDTH, INC. |
发明人 |
CRANE, JR. STANFORD W.;COLEGROVE JENNIFER;HORVATH ZSOLT;JEON MYOUNG-SOO;NICKEL JOSHUA;YANG LEI-MING |
分类号 |
H01L33/00;G02B6/42;H01L23/02;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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