发明名称 High density read only memory and fabrication method thereof
摘要 The invention relates to a high density read only memory and fabrication method thereof through fabricating a plurality of spaced post transistors on a wafer by implanting and trench etching wherein each post transistor has four vertical surfaces with one of vertical surfaces as a short circuit junction between substrate and source and a read only memory (ROM) cell formed on each of the three remaining vertical surfaces. Therefore, the invention can fabricate three ROM cells in a single post transistor having a high density feature for storing three-bit data.
申请公布号 US6699759(B2) 申请公布日期 2004.03.02
申请号 US20020103707 申请日期 2002.03.25
申请人 CHINATECH CORPORATION 发明人 LAI MAO-FU
分类号 G11C17/12;H01L21/8234;H01L21/8246;H01L21/8247;H01L27/115;H01L29/76;H01L31/113;(IPC1-7):H01L21/823;H01L21/833 主分类号 G11C17/12
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