| 摘要 |
A scanning exposure apparatus and method thereof for maintaining a desired shape of a shot area exposed on a photosensitive substrate where an angle formed by the mirrors of interferometric systems for measuring the position of a stage and/or the angle formed by the running direction of a wafer stage and a reference mark plate is changed. A reticle on a reticle minute drive stage is scanned relative to an illuminated region and a wafer on a Ztheta-axis drive stage is scanned relative to an exposure region in synchronization with the scanning of the reticle. Thus, a shot area SA on the wafer is exposed to light carrying a pattern image of the reticle. The angle of rotation of a mirror facing in the non-scanning direction of the Ztheta-axis drive stage is calculated based on measurement values of two interferometers. The angle of rotation of a mirror facing in the non-scanning direction of the reticle minute drive stage is calculated based on measurement values of two interferometers. Thus, a relative rotation angle between the wafer and the reticle during scanning exposure is corrected, based on the angles of rotation of the mirrors. A plurality of reference marks also are formed on a reference mark plate, and corresponding alignment marks are formed on the reticle. With the reticle minute drive stage and Ztheta-axis drive stage being moved in corresponding scanning directions, positional deviations between the reference marks and alignment marks are measured, and the scanning direction of the reticle is corrected based on these positional deviations.
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