MICROELECTRONIC PROCESS AND STRUCTURE

摘要

PURPOSE: A method is provided to be capable of easily integrating air as a dielectric layer in a semiconductor device. CONSTITUTION: A dielectric layer which is to be patterned to a substrate is coated on the substrate. The dielectric layer is patterned. A conductor metal is coated on the patterned dielectric layer and a common surface is formed from the conductor metal and the dielectric layer. An organic dielectric layer is formed on the resultant structure. The coated substrate contacts with a fluorine-containing compound in order to form an arrangement including air as dielectric between conductor structures and having a continuous dielectric layer on the top side.