METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND MULTI-LAYER PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method and a multi-layer printed circuit board are provided to achieve improved efficiency of area of substrate, while allowing for a high integration of circuit. CONSTITUTION: A method comprises a step of forming a metal conductive line(3) by plating a metal on a metal plate(1) on which a pattern(2) is formed; a step of forming a polymer layer(4) serving as a substrate on the metal plate and drying the resultant structure; a step of forming a via hole(5) in the polymer layer and filling the via hole through an electro-plating process; and a step of removing the metal plate.