METHOD OF PRODUCTION OF LEAD FRAME, LEAD FRAME, AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide the manufacturing method of a lead frame, the lead frame and a semiconductor device without producing strain on the lead frame even when a die pad is thinned due to coining working. CONSTITUTION: The manufacturing method of the lead frame includes a working process for forming leads 12, the die pads 13 and a plurality of support bars 11 integrating the die pad 13 into a metal band 10, a dividing process divided into a plurality of mutually separated pieces of the die pad 13 by dividing the die pad 13 integrated with the support bar 11 every support bar 11, and a coining process for thinning the plurality of the pieces of the die pad 13 by performing coining working on at least main face 13c of each of the plurality of the pieces of the die pad 13 after the dividing process.